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Specifications
General
(continued)
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
3.5
Mhrs
25°C, GB
Isolation specifications
Voltage
Capacitance
Resistance
Agency approvals
4242
10
500
cTüVus
CE Mark
Vdc
pF
M ?
Input to Output
Input to Output
Input to Output
UL /CSA 60950-1, EN 60950-1
Low Voltage Directive
RoHS
Mechanical
See Mechanical Drawings, Figures 15 – 18
Weight
Dimensions
Length
Width
Height
Thermal
0.53 /15
1.28 / 32,5
0.87 / 22
0.265 / 6,73
oz /g
in / mm
in / mm
in / mm
Over temperature shutdown
125
130
135
°C
Junction temperature
Thermal capacity
Junction-to-case thermal impedance (R θ JC )
Junction-to-board thermal impedance (R θ JB )
9.3
1.1
2.1
Ws /°C
°C/ W
°C/ W
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
Note
Primary control (PC)
DC voltage
Module disable voltage
Module enable voltage
4.8
2.4
5.0
2.5
2.5
5.2
2.6
Vdc
Vdc
Vdc
Current limit
2.4
2.5
2.9
mA
Source only
Enable delay time
240
ms
Disable delay time
40
μs
See Figure 12, time from PC low to output low
Figure 12 — V OUT at full load vs. PC disable
Figure 13 — PC signal during fault
vicorpower.com
800-735-6200
V?I Chip Bus Converter
B384F120T30
Rev. 2.4
Page 5 of 12
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